Surface Preparation and Polishing After slicing, the wafers are ground to remove saw damage and achieve a uniform thickness. Quality Control and Testing Before shipment to device manufacturers, every wafer undergoes comprehensive testing to verify its electrical properties.
The Ultra Pure Polysilicon Melting Process: From Raw Material to Molten Bath
The Crystal Growth Process During crystal growth, the molten silicon is maintained in a precisely controlled thermal environment to minimize impurities and defects. Workers wear specialized cleanroom attire to prevent contamination from skin cells or fibers.
Into this molten bath, a precisely oriented seed crystal is slowly lowered and rotated, initiating the formation of a single crystal ingot through a process known as the Czochralski method. This delicate balance of temperature, rotation speed, and crystal alignment determines the structural perfection of the resulting boule, which can weigh more than a hundred kilograms.
Ultra Pure Polysilicon Melting Process: From Raw Material to Molten Silicon Bath
From Ingot to Wafer Slicing Once the boule has cooled and solidified, it undergoes a meticulous inspection process to identify any imperfections. Production of silicon wafers begins with ultra-pure polysilicon fed into a quartz crucible, where it is melted at over 1,400 degrees Celsius.
More About Production of silicon wafers
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